Fujipoly Thermal Pad Review

It is generally used in places where there is s significant gap between the. A thermal pad is a heat conductive pad or material of a certain thickness that is used to establish heat contact between the heatsink and the chipset or source. High thermal conductivity gap filler pad 4 50.

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Fujipoly is the leader in the design formulation and production of high performance thermal interface materials elastomeric connectors and custom silicone extrusions.

Fujipoly thermal pad review.

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